By“New technologies could change the way chips are made and improve how computers handle AI and other demanding tasks.”
Lately, Intel has announced some impressive new developments at the IEEE International Electron Devices Meeting (IEDM) 2024. These innovations are aimed at making computer chips faster, more efficient, and better suited for powering artificial intelligence (AI) applications.
What Intel Did: Key Highlights of the Announcement
1. Intel is Making Chips Smarter with New Materials:
Inside every computer chip, there are thousands of tiny wires that connect different parts. Right now, most of these wires are made of copper, but as chips get smaller, copper is reaching its limits. Intel is testing a material called ruthenium, which works better in tight spaces.
It reduces something called “capacitance,” which is basically unwanted electrical interference that slows things down. Intel’s research shows ruthenium can cut this interference by 25% at extremely small scales, making it a game-changer for future chip designs.
Plus, Intel has found a way to make this process cheaper by avoiding the need for complex extra steps, which is good news for keeping production costs down.
2. Speeding Up How Chips Are Built:
Building a chip involves connecting multiple layers of components, and this can take a lot of time. Intel’s new Selective Layer Transfer (SLT) technique speeds this up dramatically—by about 100 times compared to current methods. It works by carefully transferring ultra-thin layers (called chiplets) from one place to another.
These layers are thinner than a human hair, yet they pack more processing power. This makes the final chip smaller, cheaper, and better at handling complex tasks like AI and data crunching.
The flexibility of this method also means manufacturers can mix and match different kinds of chips on the same product, which opens up new possibilities for creating more efficient devices.
3. Smaller, More Efficient Transistors:
Transistors are the basic building blocks of every chip. The smaller they are, the more you can fit on a chip, and the more powerful that chip becomes. Intel showed off transistors that are only six nanometers long—this is cutting-edge technology that keeps pushing the limits of Moore’s Law, which says the number of transistors on a chip doubles roughly every two years.
But making transistors this small isn’t just about size—it’s also about performance. Intel’s new design, called RibbonFET, ensures these tiny transistors still work reliably and efficiently, even at such a small scale. This is crucial for powering future technologies like advanced AI systems and supercomputers.
4. New Tech for Power and Radio Signals:
Gallium nitride (GaN) is another exciting material Intel is exploring. Unlike silicon, GaN can handle much higher power levels and temperatures without breaking a sweat. Intel has developed a version of GaN that’s built on a specialized type of silicon, which improves its performance even further.
Indeed, this technology could be a game-changer for things like 5G networks, which need to send strong, reliable signals, and electric vehicles, which rely on efficient power systems. By reducing signal loss and improving energy efficiency, GaN technology could make these applications work better and cost less to produce.
Why do These Tech Advancements Matter?
Imagine a world where your smartphone is faster, your laptop runs cooler, and AI systems process information instantly—all thanks to better chips. Intel’s breakthroughs are helping to make this a reality. These innovations address major challenges in making chips smaller, faster, and more energy-efficient.
The big goal? By 2030, we could have chips with 1 trillion transistors, which would unlock incredible possibilities for AI, data centers, and everyday devices. But to get there, companies like Intel need to solve big technical problems—and these new technologies are important steps in that direction.
Final Words
Intel’s advancements showcased at IEDM 2024 underline the rapid pace of innovation in the tech world. From groundbreaking materials like ruthenium to ultra-fast chip assembly methods, Intel is paving the way for smarter, more efficient technologies that will power our AI-driven future.
Furthermore, as the semiconductor industry pushes boundaries, similar strides are being made in networking. November 2024 was a pivotal month for Nokia, which announced major partnerships with Cloudbear and Deutsche Telekom to drive innovation in Open RAN, AI, and energy-efficient hardware.
Together, these advancements from industry leaders like Intel and Nokia are shaping the future of technology, promising faster, greener, and more capable systems for a connected world.
